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According to CTI, the continuous build-up of the calculus-enabled chip integrity and power density has increased significantly, with bottlenecks in traditional copper-based dispersion materials at high-heat density. Thermal conductivity of diamonds far exceeds materials such as copper, silver, silicon, and silicon carbide, and is a key direction for breaking the high-end chip-dispersed heat bottleneck. Currently, the three main routes, namely, diamond-based composites, single-crystals and polycrystals, are not fully fixed, with copper-based materials combining performance with cost, leading the industrial rhythm. The application consists of a diamond liner, a diamond thermal sediment, a diamond microchannel dispersing form, and the most commercialized of the diamond thermal sediments, copper composites of diamonds and products already available to domestic and foreign manufacturers. Diamonds are expanding from traditional grindings to semiconductor and large power unit heat, and AI computing is continuing to open up the growth space for ultra-high-conductor thermal diamond material, with a focus on industrial mass production and customer certification.