Intel works with the Honghai Strategy to promote AI cabinet, edge and physics

According to IT House, on June 5, Hong Hai Tech announced yesterday that it would work strategically with Intel to combine the advantages of Intel handlers, silicon photons and software ecosystems, and the deep foundation of Honghai ' s capacity for global manufacturing, system integration and deployment to AI data centres.

The parties will jointly explore full-dimensional AI solutions from chips, cabinets, systems to applications, and accelerate the technology driven by AI to drive edges and Physical AI applications.

First, in the area of AI cabinets, two enterprises will explore the development and commercialization of AI infrastructure solutions to cover the Intel to Power Processors-based cabinets and AI accelerator structures, and will jointly advance key technologies such as high-speed interconnection, dissipation and liquid cooling, system monitoring, and the expansion of AI data centres to provide more efficient and energy-efficient AI deployment solutions.

Both sides will jointly define the application directions of the next generation platform architecture, layout agent AI, terminal intelligence and robotics in the edge and physical/entity AI fields. This cooperation will further promote and support multiple scenarios such as smart manufacturing, smart cities, car and robotics.

In addition, the two parties will explore opportunities for cooperation in customizing design services such as ASIC, SOC and system integration, combining the full chip capacity of Intel and the complete design of the ecosystem in Hong Kong, which will cover chips, modules and systems and expand global market opportunities.

Liu Yangwei, Chairman of the Honghai Science and Technology Group, said:

AI is rapidly reshaping the global industry and social business model by actively deploying core technologies such as AI, semiconductor and intergenerational communication through the 3+3+3 strategy, and promoting the development of the three main platforms of smart manufacturing, smart motor vehicles and smart cities.

This collaboration with Intel will bring together the new generations of AI Infrastructure, Edge AI and Physical AI Ecology to accelerate the landing of AI applications, taking into account the advantages of both sides in the computing platform, system integration and global supply chains.

Intel CEO Chen Li Mu said:

The rapid growth of AI, especially the rise of large-scale reasoning and proxy AI workload, is redefining the capabilities required for modern computing. These needs depend on a comprehensive innovation that spans the entire technological stack, ranging from a new generation of silicon crystals and chips, to machine-class systems, to the deployment of border AI and Physical AI.

We work with Honghai to bring together the two sides in a deep-seated specialization in chip design, machine-class solutions and global system integration. Together, they will accelerate the development of end-to-end platforms, release new and additional capabilities and further expand AI ' s global reach.

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