Micro-innovation and strategic collaboration to advance collaborative research and development of vehicle-level chips and next generation electronic and electrical structures

On June 5th, the IT House reported that GigaDevice, a semiconductor, formally signed a strategic cooperation agreement with Kyushu today, which will establish a long-term, in-depth partnership.

The IT House has been informed that, under the cooperation agreement, the parties will fully develop their respective expertise in the areas of chip design and car-wide manufacturing and will work together to advance the collaborative development of vehicle-level chips and the next generation of electronic and electrical structures:

(a) MSI will provide high-performance, high-reliability vehicle-coded chip products and systems programmes;

To provide key guidance for pre-structure design, precise definition of needs and performance optimization of chips, and to work with whole vehicle-level validation.

Officially, the cooperation will revolve around core applications, such as smart cabins and smart driving, with the aim of facilitating the full chain of chip specification, joint research and development, to the size of the site, accelerating the process of conversion of innovative technologies to practical applications, and working together to build industry-standard solutions and products.

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